LEM Series
Camera Endpoint Monitor
The LEM Series is a real-time interferometric process monitor offering high-precision film thickness and trench depth measurement during etch and deposition processes. Featuring selectable 670, 905, or 980 nm lasers and a compact CCD camera, it mounts atop any dry etch/deposition chamber for fringe-based endpoint detection, rate monitoring, and interface identification, enabling enhanced control and reproducibility in multi-layer fabrication.
Why Choose LEM Series
- Real-time interferometric monitoring for precise film thickness and trench depth detection
- Selectable 670, 905, or 980 nm lasers for diverse material compatibility
- Fringe-based endpoint detection and interface recognition for enhanced process control
- Integrated CCD camera with frame grabber for intuitive spot positioning
- Modular design fits any dry etch/deposition chamber with top-view mounting
- Optional manual or motorized XY stage and tilt management for accurate alignment
Key Advantages of LEM Series
Flexible wavelength support
Adapts to varied film materials
High spatial resolution
Enables precise localization on wafers
Compact camera head
Ideal for limited chamber mounting
Enhanced analytics
Monitors multiple endpoints and derivatives
Technical Specifications of LEM Series
LEM
| System outline | LEM camera consists of a compact interference measurement section that includes the laser source, light receiver, and optical components, as well as the illumination and CCD imaging camera, allowing monitoring of any area of the wafer surface using microscopic images. | ||||||
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| Light source | Laser diode | ||||||
| Light source wavelengths | 670 nm, 905 nm, 980 nm | ||||||
| Magnification | 50x (G50) or 120x (G120) | ||||||
| Spot diameter | 20 μm to 100 μm, depending on camera to wafer distance | ||||||
| Detector | Pin-photo diode | ||||||
| Camera Dimensions | 65 (W) × 160 (H) × 100 (D) mm 2.6 (W) × 6.3 (H) × 3.9 (D) in (camera only, excluding stage) | ||||||
| Camera mass | 1.2 kg, 2.6 lb | ||||||
| Remote | LEM-CT only may be connected to any host through digital Link with RJ 45 connector: TCP/IP.
scrollable This permits to communicate by logic wiring, fast, deterministic with full optocouplers and power spikes isolation, frequently found in industrial fab environment | ||||||
| LEM SIGNAL BOX | LEM-CT only is provided with a LEM Signal BOX connected in USB on the PC to collect:
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| Certification | CE |
Windows 10 PRO, 64bits PC Controller
| DC Power Supply | 24V |
|---|---|
| SSD | 256 Go, 2,5” SATAIII |
| Design | Aluminum Frame, fanless design Anti-vibration and shock resistant |
| Connection | RS-232/422/485 RS-232 USB 3.0 on Standard 2x RJ45 Gb VGA, HDMI … |
| Standard PC (Default) | |
|---|---|
| CPU | 64bits, Intel® Pentium® N4200, 2.5 GHz |
| RAM | 4Go DDR3 |
| Controller Dimensions | 197 (W) x 110 (D) x 55 (H) mm |
| Controller Mass | 2 kg |
| High Grade PC (Optional) | |
|---|---|
| CPU | 64bits, Intel® Core™ i7-7700T 2,9 GHz |
| RAM | 8Go DDR4 2133MHz |
| Controller Dimensions | 264 (W) x 96.4 (D) x 186.2 (H) mm |
| Controller Mass | 4.5 kg |
Option
| Manual XY stage | |
|---|---|
| Motorized XY stage | |
| Manual XY stage Travel range | ±8.0mm |
| Manual XY Stage dimensions | 120 (W) × 120 (H) × 87 (D) mm 4.7 (W) x 4.7 (H) x 3.4 (D) in |
| Manual XY Stage Mass | 1.3 kg, 2.8 lb |
| Motorized XY stage Travel range | ±12.5mm |
| Motorized Stage dimensions | 167 (W) × 117 (H) × 112 (D) mm 6.6 (W) × 4.6 (H) × 4.4 (D) in |
| Motorized Stage Mass | 2.6 kg, 5.6 lb |
| Software |
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| Accessories for SEQ70-PIO box and PC |
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| Various Configurations |
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Environmental
| Operating Temp/humidity | Temp：18℃～50℃ Humidity：0～70％RH （No dew condensation） |
|---|---|
| Transportation Temp/humidity | Temp：-20℃～55℃ Humidity：0～70％RH （No dew condensation） |
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